The Particle and Microsurface Characterization Laboratory (LCPM) and the Thermal Analysis Service (SAT) will be closed from July 20 to 23, 2026, inclusive, due to the organization and celebration of the Particle Characterization and Rheological Behavior Analysis Conference, which will take place in the SEGAI Building.
During those days, rehearsals and service requests will not be possible. Normal operations will resume on Friday, July 24.
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